Micro-engraving unique ID Codes on firing pins provide forensic scientist with new tools for solving crime scenes

LAKE MARY, FL-(August 18th, 2015)- Fonon Corporation (“Fonon”) is pleased to announce recent advances in laser micro-engraving technology allowing the precise, microscopic stamping of unique ID codes on firing pins making it possible to link shell casings recovered at crime scenes to the firearm that fired them.  When the firearm is discharged, a unique alpha-numeric code identifying the weapon’s make, model and serial number is “fingerprinted” onto the primer or rim of the cartridge case.

Fonon’s advanced micro-stamping technology now provides firearm manufacturers with new tools that help law enforcement deter gun trafficking.  Traffickers generally purchase guns with the intent to illegally transfer the weapon to others.  Traffickers who purchases guns for this purpose would now be on notice that the cartridge shell could be used to trace the gun back to them if the gun was used in the commission of a crime.

The American Bar Association (ABA) has recommended that federal, state, and territorial governments enact microstamping laws that would enable law enforcement officers to identify the weapon used in a crime and the purchaser of the firearm.  The ABA concluded, “Microstamping technology will be a material aid to law enforcement in the effort to solve crimes committed by use of guns.”  With California taking the lead, similar legislation continues to be discussed in New York, Connecticut, Rhode Island, Massachusetts, Maryland, Wisconsin and Illinois with other states monitoring the legislation progress.

About Fonon Corporation

Fonon Corporation is the recognized leader of industrial-grade 3D Additive and Subtractive laser-based material processing systems.  Our systems are used world-wide in the semiconductor, flat panel display, automotive, aerospace, industrial, defense, electronic and medical industries with a portfolio of intellectual property, knowhow & inventions placing our company in the unique position to offer both standard 3D material processing systems or our specialty of tooling 3D laser-based transforming systems designed around the unique applications of our customers.

Notice Regarding Forward-Looking Statements:
NOTE: This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 involving risks and uncertainties. Results, events and performances could vary from those contemplated. These statements involve risks and uncertainties which may cause results, expressed or implied, to differ from predicted outcomes. Risks and uncertainties include but are not limited to product demand, market competition and the company’s ability to meet current and future plans. Investors should study and understand all risks before making an investment decision. Readers are recommended not to place undue reliance on forward-looking statements or information.  Fonon is not obligated to publicly release revisions to any forward-looking statement, to reflect events or circumstances afterward, or to disclose unanticipated occurrences except as required under applicable law

First Time User:
Looking to incorporate laser based marking and engraving services for value added revenue or upgrading to a faster laser based printing technology for Direct Parts Marking that is permanent, non-removable and legible?  Rent a LaserTower Compact or MarkStar Professional to gain the experience and market your new services before you decide to buy.  Renting is lower risk, less expensive and requires no capital equipment funding.

View the Rental Program Details here

Upgrade Your Current System:
Upgrade your older 20W Fiber laser marking and engraving system with a new 50W Fiber laser essentially resetting the MTBF clock back to zero and more than double your throughput rate.  Upgrading your existing system makes since to expand capacity without having to purchase a new system.  Easer to upgrade from operational funding sources than the challenging process to secure approval through your company’s capital equipment funding process.

Trade-In Your Older System: 
When it is time to purchase a new marking and engraving system, trade-in your old system to receive credit towards the purchase of a new Fiber laser marking and engraving system.  Fonon will perform a QC diagnostic test to determine what hardware is salvageable for our applications lab or refurbished system program and receive credit towards the purchase of a new marking and engraving system from our extended family of LaserTower Marking and Engraving Systems.

View the Family of Laser Tower Systems here

Fonon’s 3D Laser ZWLCT™ Glass Cutting Systems Have No Peers…

Fonon Technologies’ patented Zero Width Laser Cutting Technology (ZWLCT™) is a major discovery that remains the superior technology of choice today by Mother Glass Foundries. The demand for these systems remains high as new off-shore Flat Panel Display, Semiconductor and Electronic manufacturing facilities continue to emerge globally to support new market growth and cost reduction initiatives.

Zero Width Laser Cutting Technology has been optimized for thin-glass applications up to 1.0mm.

No other competing technology comes close to matching the superior performance of Fonon Technologies’ ZEROKerf™ glass cutting technology. Our patented process significantly increases edge quality and strength. Edge Impact Strength is increased up to 10 times when compared to full-contact mechanical scribe and break systems, while overall Glass Component Strength is improved up to 80%. ZWLCT™ splits materials at the molecular level under a non-contact process with tremendous speed resulting in no material loss, chips, lateral cracks, protrusions, hooks and flares or any other forms of contaminants.

ZWLCT™ eliminates surface degradation 100%, resulting in zero yield loss due to particulate damages across the glass surface caused by undesirable contaminates created by conventional mechanical scribe methods.

ZWLCT™

At the molecular level, Fonon Technologies’ patented ZWLCT™ generates a controlled MicroCrack™ to any selectable depth through glass (and other brittle materials) at a controlled, optimized angle to the surface of the material. By controlling the laser beam’s energy distribution under a proprietary temperature stress profile, the process creates scribe lines in a prescribed manner with no molecules leaving the surface of the glass, dramatically improving the substrate separation process.

The ZWLCT™ method incorporates cooling of the glass surface following controlled heating with the correct power density profile. This creates the intermolecular separation of the glass substrate to a predetermined depth.

Fonon Technologies’ 3D Laser ZWLCT™ Glass Cutting Systems can also be modified to enable the crossing of the laser cuts to provide a complete turnkey ZeroCut™ high-volume wafer dicing station.

Manufacturers and consumers benefit immediately from higher material strength as Fonon Technologies’ patented ZWLCT™ technology reduces production and handling damages at the factory while reducing premature latent product failures in the field due to shock.

Fonon Technologies optimizes each 3D Laser ZWLCT™ Glass Cutting System in response to continual advancements of customer applications.

Advantages of ZWLCT™ include:

1. High cutting speed  up to 1000 mm/sec
2. Extremely high accuracy up to 10 microns achievable
3. No post treatment of edges, such as grinding or edge seaming required
4. Process unlimited component sizes up to Gen-10 and higher
5. Easily adaptable to glass thickness changes during production
6. Increased glass strength with no material loss or latent defects
7. Excellent surface integrity of cut surface with no cracks or chips
8. Precise edge geometries with almost any possible contour
9. Edge Impact Strength up to 10X that of mechanical scribe & break methods
10. Cut edges free of stress with Glass Component Strength improved 80%

FLAT PANEL DISPLAY Processing Flat Panel Display Glass with ZWLCT™ technology improves edge impact strength up to 10 times and overall component strength up to 80% compared to conventional mechanical scribe methods. Fonon’s ZWLCT™ glass cutting systems reduce manufacturing costs, increase profit margins and dramatically increase yields providing a turnkey system that simultaneously laser scribes and breaks in one system.

THIN FILM TRANSISTORS (TFT) TFT liquid crystal displays improve image qualities including addressability and contrast in computer monitors, mobile phones, navigation systems, hand-held video game systems and television sets. Incorporating ZeroCut™ technology ensures the break line is the scribe line with no lateral cracks, serrations, surface deterioration or abasement. Fonon’s patented ZWLCT™ increases both the number of die and yield count of each TFT wafer continuing to lower production costs and increasing profit margins.

GLASS SEMICONDUCTOR WAFERS Wafers have the highest value at the dicing stage. It is critical from this point forward through the rest of the manufacturing process to maintain the highest yields and die count. Wafer Carriers, LEDs, Optical Sensors & Detectors, CMOS Image Sensors and Bonding Silicon-On-Insulators to glass wafers incorporating ZWLCT™ allow closer die spacing increasing the number of die/wafer. With no material breaching or fissures, yields are dramatically improved lowering production costs while eliminating potential latent field failures.

OPTICAL COLOR FILTERS Optical color filters are widely used in CRT Display, LCD, FED, CCD, Electronic Instrumentation, Telecommunication and Medical Devices. With 3D ZEROKerf™ processed glass, there are no chips, protrusions, scallops or hooks & flares materially increasing quality and longterm reliability while measurably reducing production costs.

SOLAR PANEL WAFERS Solar Panel Photovoltaic Wafers enhanced with ZWLCT ™ boost yields as scribe lines are created in a predetermined manner with no molecules leaving the surface of the material. Solar Panel manufacturing throughput rates increase dramatically. ZWLCT™ lowers manufacturing costs, increases profit margins and improves the quality of Solar Panel Wafers.

SCANNING MIRRORS Even Fonon’s 3D Metal Printer Systems and 3D Material Processing Systems benefit from ZEROKerf™ processed scanning mirrors used on Galvo Scan Heads as there is no breaching of the breaking crack into the body of the material. Fonon’s patented ZWLCT ™ provides the highest quality and long-term reliability for all glass cutting applications

HARD DISK DRIVES (HDD) Hard Disk Drives store and retrieve digital information using rapidly rotating platters coated with magnetic material. Fonon’s patented ZWLCT ™ Technology is a non-contact 3D laser stress-free process that dramatically increases yields as there are no contaminants generated to degrade the working surface of data storage disks.

MULTI-VESSEL PRESSURE WINDOWSHigh-Strength Pressurized Windows in spacecrafts, high-altitude aircraft and deep sea submersible vessels demand ZWLCT ™ when edge strength is critical. Combined with Fonon’s patented Extra Low Pressure Grinding Technology (ELPGT™), grinding, lapping and polishing multi-vessel pressure window applications ensures the highest quality and reliability when there is no margin for error.

DNA HISTOLOGY GLASS SLIDESFonon Technology has ZWLCT ™ application specific cutting systems that manufacture highvolume histology slides creating no glass particulates that could contaminate the entire working surface potentially corrupting DNA samples

New Generation PV Solar Tracker to Feature an Integrated Solar Array and Bifacial Solar Panels

Arlington, VA. February 20, 2013 – Fonon Corporation, a leading of  manufacturer of photovoltaic (PV) equipment, components, and provider of turnkey alternative energy generating systems, today announced it has launched its next generation SolarTower – a dual axis PV tracking system featuring an integrated solar array and bifacial solar modules.

The dual-axis solar tracker is designed to maximize solar tracking performance while reducing costs and operational risks for large commercial and utility scale solar power plants. The solar tracker uses a motor and GPS (Global Positioning System) to turn the solar PV panels both from east to west and up and down to ensure the panels always follow the sun’s elevation.

The solar tracker system includes six high-efficiency crystalline silicon photovoltaic modules. Compared to a fixed array of the same production capacity, the Fonon solar tracker will produce up to 37% more electricity.

SolarTower is the first PV tracker to feature an Integrated Solar Array (ISA) – an innovative design solution that reduces the cost of balance of systems (BOS) and solar panels. It fully integrates the solar PV modules into the mounting structure thereby eliminating the aluminum frame, grounding wire, clips, nuts, and bolts.

SolarTower will offer bifacial solar panels – dual sided glass modules (G2G) that generate more electricity by converting direct, radiant and scattered solar energy on both the front and the back side of the module. A thinner tempered glass means less light trapping inside the glass increasing overall module efficiency. Proprietary IR resistant encapsulate will increase the life expectancy and energy production over the lifetime of the module, while maximizing the time per day modules can generate electricity from sunlight. Together these features can result in additional energy output as much as 30%.

Fonon Corporation is a diverse product solutions company providing comprehensive design, manufacturing, and technology services to aerospace, construction, defense, energy, industrial, photonics, and PV solar customers worldwide. For a quarter century, Fonon has been a technology innovator in equipment, components and fabrication. Today, the company is leading the way for America to go from energy efficiency to energy independence. www.fonon.com

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Deployable photovoltaic mobile power generation designed for smart tactical micro grids.

Arlington, VA, USA, November 27, 2012–Fonon™ Corporation, a diverse product solutions company providing comprehensive design, manufacturing, and technology services to global companies, today announced it is developing a new energy generating vehicle (EGV) as a solution for energy use on the battlefield.

EGV’s allow for mobile deployment of vehicles that produce energy at the source it is consumed. Equipped with photovoltaic energy generating systems, these vehicles can be used to power the on-board systems or to energize a Battery Energy Storage System (BESS).

Used as a stand-alone energy source, a BESS provides remote locations with a dependable source of energy. They can be deployed fully charged or in conjunction with energy generating vehicles, can be recharged while deployed in order to provide a constant energy source for mobile command stations or emergency management scenarios.

The Fonon EGV is a mobile energy hub that can be used for all tactical and support vehicles.

A battery energy storage system can exist as part of an EGV or a stand-alone armored unit. An armored container can serve as electrical power storage housing and forms a power hub. Any military or emergency response vehicle can be directly connected to a power hub.

The Fonon EGV features a 50kW mobile array of bifacial cell dual sided glass modules. Bifacial modules generate more electricity by converting direct, radiant and scattered solar energy on both the front and the back side of the module. Glass-to-Glass (G2G) modules provide dual sided protection of silicon materials from extreme weather conditions. Thinner glass ensures less heat, thermal stability, resistance to impact and elimination of micro fractures: thereby reducing the probability of mechanical damage to the modules.

Reducing demand for energy on the battlefield is a goal for the DoD.  EGVs help to increase the energy efficiency of operations; limit the risk troops face as they use, transport and store energy; and minimize defense dollars spent on consuming energy. The DoD Operational Energy Strategy is to “integrate energy efficiency and renewable energy into our forces, installations, base camps and operations around the world.”

Fonon ™ Corporation

Fonon Corporation is a diverse product solutions company providing comprehensive design, manufacturing, and technology services to global aerospace, construction, defense, energy, industrial, photonics, and solar companies.  For a quarter century, Fonon has been an innovator leading the way from energy efficiency to energy independence. www.fonon.com

Contact: media@fonon.com

Government Affairs Office to Serve Military and Defense Industries in the Nation’s Capital

Arlington, VA, November 20, 2012 – Fonon™ Corporation, a diverse product solutions company providing comprehensive design, manufacturing, and technology services to global companies, today announced the opening of its new government affairs office in Arlington, Virginia. The office is schedule to open December, 2012 and will be managed by Paul Sachdeva, Director.

Fonon Corporation is a diverse product solutions company providing comprehensive design, manufacturing, and technology services to global aerospace, construction, defense, energy, industrial, photonics, and solar companies. For a quarter century, Fonon has been an innovator leading the way from energy efficiency to energy independence.